> Hi Techies, > we had following occurence with OSP-boards (Entek+) & throug hole > components (THC): > 1.reflow, then wave solder the THC: The THC have a nice solderjoint, > which is not going throughout the hole. According to our design rules, > this is a bad joint. Is that singular for ENTEK? This behaviour may prevent the usage of OSP, because the rules are somehow holy. > Any comments or suggestions? > > Wolfgang Nuechter > Robert Bosch > Germany > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################