Terri- I believe that LEADED ceramic parts should be ok on regular (PI or FR-4, etc.) organic laminate PWB, along side with plastic ICs. LEADLESS ceramic parts must be on controlled CTE (i.e., lower CTE than FR-4, lower than ~ 18 ppm/deg C) PWB, which should be ok with leaded plastic ICs. Michael Alderete You wrote... ------------------------------ Date: Fri, 9 Oct 1998 12:30:17 -0400 From: "Neubauer, Terri" <[log in to unmask]> Subject: Ceramic vs. Plastic Components Greetings TechNetters! My company is able to custom design PWBs with low surface CTE for use in military / space environments. Then along come the plastic parts. I have been tasked with determining how to best use ceramic and plastic parts on the same PWB. As I am a material engineer, I am not that familiar with component parts and their sources. However, I am all too familiar with CTE mismatches in general and realize that this is a major part of this specific problem. 1. What are some good information sources? (Companies, web sites, papers, etc.) 2. What design issues should I focus on? 3. What board manufacturing issues are there to consider? 4. What assembly headaches are looming in my future? I would greatly appreciate any and all guidance on these issues. Thanks in advance! Terri Neubauer ------------------------------ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################