hi, well, the nice thing about ansi/ipc-d-275 is that they don't pussyfoot around this issue. they must have actually had manufacturing in mind when they wrote the following paragraph and inserted figure 4-38. '4.4.2.1 end-capped discrete components. end-capped discrete resistor and capacitor components, and similar leadless end-capped discrete components, shall not be stacked, nor shall they bridge spacing between other parts or components, such as terminals or other mounted compnents (see figure 4-38). 'end-cap discrete leadless components with electrical elements deposited on an external surface, such as chip resistors, shall be mounted with the deposited surface facing away from the printed board (see figure 4-39).' don't need a lawyer here do you? phil crepeau -----Original Message----- From: Paul Klasek [mailto:[log in to unmask]] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################