Dear Sir :

I work inn a high frequency PCB manufacturing company and I have the

following questionns :

1/ Why is it for copper plating (acid copper plating) the lower the
   current, the more the throwing power ? If I start to plate copper
   on the PTH walls with high current density after PTH, what will
   happen ?

2/ Our customer always specify to have a certainn thickness innside the
   PTH walls for copper. Why is that so for high frequency PCB ?
   What happen if copper thickness is thinner than the specified
   thickness at high frequencies ?

Thanks for your help !!!!!!!

my e-mail : [log in to unmask](this is only text base, pls do not send
                                      graphics)

Thamks again!!!!!!!

Francis

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