Folks, Does anyone have information concerning the amount as percentage of phosphorous in electroless nickel solutions that correlates to excess intermetallic formations in electroless gold over electroless nickel over copper solder termination areas leading to SMT solder joint failure? Am I really seeing some people addressing this issue by saying under 7% is the maximum limit to ensure long term SMT solder joint reliability? Am I seeing some people saying this is possible and still provide an adequate nickel barrier between copper pads and the gold protecting them? Is there an answer to ensuring reliable solder joints using electroless Au/Ni or a much better alternative to it and HASL? Thank you, Earl Moon ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################