Folks,

Does anyone have information concerning the amount as percentage of
phosphorous in electroless nickel solutions that correlates to excess
intermetallic formations in electroless gold over electroless nickel
over copper solder termination areas leading to SMT solder joint
failure?

Am I really seeing some people addressing this issue by saying under 7%
is the maximum limit to ensure long term SMT solder joint reliability?
Am I seeing some people saying this is possible and still provide an
adequate nickel barrier between copper pads and the gold protecting
them? Is there an answer to ensuring reliable solder joints using
electroless Au/Ni or a much better alternative to it and HASL?

Thank you,

Earl Moon

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