<color><param>7F00,0000,0000</param>> I would like to find the through hole component land > macro for wave soldering process and the relation between > hole diameter and land size. Can anyone tell me any > standard available? Will the land macro be different for > single side or multilayer PCB? > > Thanks, > WM Cheng I'm not sure if this is what you're looking for, but here goes anyway: Take drill size (finished hole size + .005") plus 2X the minimum annular ring required (maybe .002" for outer layers) plus a manufacturing adder, (.012" is considered reasonable by most vendors) to reach the required land diameter. So, assume a .032" dia. hole, .032+.005+(2X .002)+.012=.053" <italic>minimum </italic>diameter land. Tom Hybiske General Atronics Corp. Wyndmoor, PA <nofill> ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################