We are currently establishing a in-house BGA process and have several questions: 1) What is an acceptable amount of times a BGA device can be reworked, reballed, and remounted? 2) What are the critical elements to consider and why? 3) What is the maximum number or percentage of solder voids allowed per solder joint (bump) connection? 4) Any recommendation regarding rework equipment. 5) Has IPC released a BGA standard? If so, can you email, fax me a copy of the section concerning about the maximum number or percentage of solder void allowed per solder joint.. I need the info. ASAP. Paul Yan LeeMah Electronics 1088 Sansome St. SF, Ca 94111 Email - [log in to unmask] Phone - 415-394-1288 X265 Fax - 415-394-7682