We are currently establishing a in-house  BGA process and have several
questions:

1) What is an acceptable amount of times a BGA device can be reworked,
reballed, and remounted?

2)  What are the critical elements to consider and why?

3)  What is the maximum number or percentage of solder voids allowed per
solder joint (bump) connection?

4) Any recommendation regarding rework equipment.

5) Has IPC released a BGA standard?  If so, can you email, fax me a copy
of the section concerning about the maximum number or percentage of
solder void allowed per solder joint..

I need the info. ASAP.

Paul Yan
LeeMah Electronics
1088 Sansome St.
SF, Ca 94111

Email - [log in to unmask]

Phone - 415-394-1288  X265
Fax -     415-394-7682