Dear Technetter.
        We are facing Solder Ball problem for SMT No-Clean process. The
balls are always in contact with 0603 Chip capacitor and resistor and also
fixed by flux. Diameter of the balls is less than 5 mils.
        Stencil thick is 6 mils. Stencil apertures of the 0603 component are
home plate shapes. Solder paste thickness is about 7.4 mils.
        We had extended preheat portion of reflow profile to cure solder
paste and reduce peak temperature of reflow portion to stop splash but
solder balls are still found after reflow.
        Would anybody please suggest us how to eliminate the solder balls.
Thank you.
Mark.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################