Rod: The guidelines we have established here are as follows: Total combined voiding <25% Less than or equal to 3 separate voids No two voids can intersect, irrespective of size/percentage Another 2cents... > -----Original Message----- > From: Rod Martens [SMTP:[log in to unmask]] > Sent: Wednesday, October 07, 1998 2:48 PM > To: [log in to unmask] > Subject: Re: [TN] Voiding in BGA > > I've never seen an exact number for voiding, but would be interested > if anyone > does have one. As for personal experience, we have seen cases where a > single > large void or many small voids aligned at an interface negatively > impacted the > reliablility. Also, we saw a case where some degree of voiding > actually > increased the life of BGA's, most likely due to some sort of crack > arrest > mechanism. I would imagine that a good number for max. voiding would > need to > include not just % void, but also position in the joint. > My $0.02, > Rod Martens > > -----Original Message----- > From: Non-HP-FEiranova > /hp-ftcollins,[log in to unmask] > Sent: Wednesday, October 07, 1998 2:39 PM > To: Non-HP-TechNet /hp-ftcollins,[log in to unmask] > Cc: Non-HP-FEiranova > /hp-ftcollins,[log in to unmask] > Subject: [TN] Voiding in BGA > > To all: > Is there a specification to address the maximum voiding allowed > for PBGA and CBGA solder joints attached to FR-4 substrate ? > Can anybody share some personal experiences in this matter ? > Thanks > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following > text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for > additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 > ext.312 > ################################################################ > << File: [TN] Voiding in BGA.TXT >> ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################