Hello all, We are trying to remove and replace two ORCA 432 pin BGA's on a big 14-layer board. We are getting alot of shorts after the rework(I'm x-ray inspecting). At first we tried solder pasting the pads with a mini stencil, but the amount of bridging we got caused me to try just fluxing the pads and letting the solder balls collapse, but we still got a lot of shorts. I am also noticing a lot of board warpage during the rework heat cycle and it also appears that during reflow if I watch the component, the corners of the BGA collapse very early and the component almost appears to be bowing. Most of the shorts we are getting are in the corners where this last observation occurs making me think it is causing the shorts. Any suggestions on how to eliminate this problem? Thanks, Tim Stammely Manufacturing/Process Engineer MSI Manassas, VA ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################