Hello to all the people in this list. I hope you can help me. 1. Now that the direction the industry is taking is towards the development of packages with reduced lead widths (primarily because of the shrinking package size), is the "Dip and Look" method still the preferred test for Solderability Test? 2. I have asked around other assembly companies and those who purchased the Wetting Balance system told me that they are unable to qualify the machine because of "calibration problems" and never got to use it since it was purchased. Do we have somebody here who encountered similar problems? Was it ever resolved? How? If there are suppliers of various Solderability Testers here, kindly e-mail me privately ([log in to unmask]). Thanks a lot. Best Regards, Lei Tumibay Lead Finish Group - Assembly Engineering Analog Devices - General Trias Cavite, Philippines E-mail: [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################