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-----Original Message-----
From: Xingsheng Liu <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, September 10, 1998 7:40 PM
Subject: [TN] Underfill materials

>Hi, everyone,
>
>Can anyone introduce me some underfill materials? Details of the
>materials properties and vendor's information such as address, phone
>number are appreciated. Thanks!
>
>Have a nice day.
>
>Xingsheng Liu
>
>
>
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