I am looking for advice from anyone with experience in fixturing large flexible circuits (2 mil polyimide) for SMT processing. Reflow will take place in a forced convection reflow oven. I'm considering mounting the circuits to FR4 using a high tack/low tack double-sided adhesive or kapton tape around the perimeter. I'm not sure how well the adhesive will hold up at reflow temperatures. Any specific advice learned from experience?

Kent Asmus
TRW, Inc.
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