In a message dated 9/15/98 7:19:48 AM Pacific Daylight Time, [log in to unmask] writes: << I am curious, why are the ceramic BGA solder balls not eutectic and made with the 90/10 Pb/Sn solder? >> Me too! I just ran a board that had a 144-pin micro-bga that appeared to have high temperature balls on it. I'll usually do a cursory visual check on the bga devices after reflow by holding the board on edge under a microscope, and looking at the outside row of balls to see the filleting I'm expecting when the paste, placement, and profile is in there...however, I didn't see that with this last board. I reflowed under a profile that I know was good, I peaked at 219 C. I was almost tempted to bump things up a bit but remembered that there are high temperature balls out there. If the reason is because the device generates the kind of heat that needs hot balls (this is almost sounding pornographic...hehehe), then should we be soldering them with a higher temp alloy than a 63/37? -Steve Gregory- ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################