There is something called an Industrial Trade Design, which if I remember correctly does cover manufacturing and assembly processes. Basically if you invent a better way of manufacturing something, you can apply for patent protection and then sell this assembly process. I have some books on this subject at home I will check this weekend and get back to you. Ryan Chase > Date: Fri, 11 Sep 1998 12:44:02 -0400 > Reply-to: [log in to unmask] > From: Ryan Jennens <[log in to unmask]> > Organization: Phoenix Engineering Design, Inc. > Subject: Re: [TN] soldering patents > X-To: [log in to unmask] > To: [log in to unmask] > Ed- > > This sounds to me like a solid-solder-deposit technology, where the assembler purchases the bared PCB > with the solder already deposited and reflowed. The parts are then placed, with the help of tacky flux, > and reflowed again. The idea is to eliminate the pasted deposit process which is inherently difficult to > accurately reproduce 100% of the time because it is so susceptible to so many variables. They claim they > can reduce paste solder defects by up to 70-80%. MaskTek and Sipad are two companies with proprietary > applications of this technology. I'm sure I'll read about it if I am wrong : ) > > Ryan Jennens > Phoenix Engineering > > Ed Holton wrote: > > > Fellow professionals: > > Yesterday, while doing some research on soldering and a new soldering > > method, I discovered that there is a number of U.S. patents for soldering > > and soldering techniques. I remember several months ago, there was some > > discussion about another company having a general SMT assembly process > > patent, but I never found out what the resolution of the issue was. For > > example, below is a copy of the abstract of U.S. Patent # 4,605,153 I found > > during my research. To me, this sounds like the reflow pads used for MELF > > components. I have used this pad numerous times over the years, getting > > the idea, and seeing it discussed in SMT magazines, at NEPCON seminars, and > > in the IPC design standards. There were numerous other patents listed as > > reference with this patent, all pertaining to soldering. > > > > I am not a patent lawyer, and my knowledge of law is limited to one > > Business Law class in college and the reading of John Grishm novels. I > > consulted our company lawyer, and he has a basic knowlege of patent law, > > but was unable to answer the question. He could research it futher. I > > thought I would ask my fellow professionals first. > > > > The question: If there is a U.S. Patent for a soldering process, can the > > method be used by other companies for assembly? If it is a new process, is > > permission needed, etc.? If the process is already in use, learned as > > described above, what are the legal ramifications? All of my assembly > > knowledge is based on practical experience, reading of journals, training > > classes and discussions with you, my fellow professionals. Never has > > anyone ever stated that an assembly process is patented, and you must > > obtain permission to use this process, or pay royalties, etc. To find that > > a SMT pad design is patented really amazed me, if this idea is patented, I > > am sure that with futher research that there are numerous other patents for > > all aspects of assembly and soldering. At what point, or how is it > > determined if the patent is proprietary or is it public domain? > > > > Thanks > > > > Ed Holton > > Manufacturing Engineer > > Hella Electronics > > > > THE PATENT: > > > > United States Patent > > > > 4,605,153 > > Van Den Brekel, et. al. > > > > Aug. 12, 1986 > > > > Shaped solder pad for reflow soldering of surface mounting cylindrical > > devices on a circuit board > > > > Abstract > > > > A solder pad is provided at each end of a mounting position for a > > cylindrical electronic device on a circuit board. Each solder > > pad has two humps of solder spaced apart in a direction normal to the axis > > of the device, the humps defining a channel in which > > the end of a device can rest prior to being reflow soldered. The humps have > > a convex arcuate outer surface in plan view and > > when viewed in a direction parallel to the axis of the device has a profile > > which is of convex arcuate form. The humps are > > formed by depositing a thick patch of solder paste at each hump position > > and heating the circuit board and solder paste to melt > > the paste. After positioning of devices, the solder is reflowed to attach > > the devices. > > > > Inventors: > > Van Den Brekel; Jacques (Nepean, CA); Ho; Thomas K. Y. (Ottawa, > > CA). > > Assignee: > > Northern Telecom Limited (Montreal, CA). > > > > ################################################################ > > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > > ################################################################ > > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > > To subscribe: SUBSCRIBE TechNet <your full name> > > To unsubscribe: SIGNOFF TechNet > > ################################################################ > > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. > > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > > ################################################################ > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################ > > Ryan Chase Manufacturing Engineer GE Harris 403-214-4502 Fax 403-287-3107 [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################