My first stab at your situation would be that you're not getting a good time above reflow to allow your intermetallic layer to form a good bond between your solder and lead. The intermetallic layer is hard and brittle, and should be minimized, however it is necessary. Do a cross section of the bond if you're even getting good wetting and wicking to the lead. Analysis under a scope is probably going to answer your own question. Appears that you either have too much or not enough heat. Your profile is the key in my opinion. Jason Smith Process Materials Engineer Lexmark Electronics ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################