A couple of things to consider..

1. Is the lead of the dip firmly seated on the topside of the PWB, the
shoulder where the dip lead widens is in contact with the laminate.  If it is,
the there is no stress relief between the the top of the PWB to the solder
joint during thermo-cycling.

2. Thermo-cycling of such a limited design will probably result in the failure
of a number of conventional part styles that assume a plated thru hole design
is used.  Any part which seats on a stepped portion of the lead will likely
crack the solder fillet.  The full solder joint using a plated thru hole is
not only about 7 times stronger than the pad only design of single sided
boards, but solders the area from the pad to the stepped area of the lead,
eliminating the stress.

Good luck,
Steve Mikell
SCI SYSTEMS
Plant 13

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