A couple of things to consider.. 1. Is the lead of the dip firmly seated on the topside of the PWB, the shoulder where the dip lead widens is in contact with the laminate. If it is, the there is no stress relief between the the top of the PWB to the solder joint during thermo-cycling. 2. Thermo-cycling of such a limited design will probably result in the failure of a number of conventional part styles that assume a plated thru hole design is used. Any part which seats on a stepped portion of the lead will likely crack the solder fillet. The full solder joint using a plated thru hole is not only about 7 times stronger than the pad only design of single sided boards, but solders the area from the pad to the stepped area of the lead, eliminating the stress. Good luck, Steve Mikell SCI SYSTEMS Plant 13 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################