Dear Mr.Simmons ! Production status of Build-up multilayer boards in Japan is as follows. '97(result) '98(plan) Build-up(photo,laser) 214 M$/year 505 M$/year (\130/$) % in total multilayer boards 5.8% 12.3% Photo Via 12,000m2/month Laser Via 32,000m2/month Regards, Motoyo Wajima General Purpose Computer Division,Hitachi Ltd.(Japan) Mark Simmons $B$5$s$O=q$-$^$7$? (B: >I want to open by flattering everyone on the list. Then move right into >a genuinely contrite request for some input. I'm probably not the only >one wondering about the immediacey of demand for High Density Circuits >(build up/ sequential / requiring ablated holes. I read an article in a >recent trade pub that sez; Japan is currently building approx 14,000 >sq.meters per month. I translate this as approx. 10,000 18x24 panels per >month. The story goes on to project a 30% increase by year end '98. > >This dosen't seem like a lot to me. I suspect much less here in the >States. (I'm not including the BGA or Transposer product which is >replacing ceramic substrates.) > >The Question: What products are driving the demand for this process? > Are we satisfying the need for smaller space requirments? > Are we satisfying the need for faster signal speed? > How far away is the horizon for these applications? > Are these all products we will be buying? > >Any and all input is welcome and appreciated. > >Thanks in advance, > >Mark Simmons >ps i promise to get a spell checker in the near future. > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 >################################################################ > > *********************************************** Motoyo Wajima General Purpose Computer Division,Hitachi,Ltd. 1 Horiyamashita Hadano-shi,Kanagawa-ken,259-13 Japan E-mail:[log in to unmask] Fax:+81-463-88-2935 *********************************************** ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################