I need to know what the appropriate cleanliness specification is for no-clean
processes for mixed technology printed circuit boards, fully assembled.  The
IPC-A-610 paragraphs 5.0 reference the J-STD-001 and IPC-TM-650.  These
reference the standard test parameters of 1.56 ug/cm2, or 10ug/in2.

I am needing input on the correct test methods and standards for no-clean
processes.

Thank you very much for your information.

Mary C. Smoot
Lexmark Electronics
740 New Circle Rd NW
Lexington, KY 40550
606-232-6687
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