I need to know what the appropriate cleanliness specification is for no-clean processes for mixed technology printed circuit boards, fully assembled. The IPC-A-610 paragraphs 5.0 reference the J-STD-001 and IPC-TM-650. These reference the standard test parameters of 1.56 ug/cm2, or 10ug/in2. I am needing input on the correct test methods and standards for no-clean processes. Thank you very much for your information. Mary C. Smoot Lexmark Electronics 740 New Circle Rd NW Lexington, KY 40550 606-232-6687 [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################