Ron, Have you conclusively determined that it's a Phos. issue and not a thermal profiling issue? Jeff Perkins Photocircuits -----Original Message----- From: Ron Hollandsworth [SMTP:[log in to unmask]] Sent: Monday, September 21, 1998 12:38 PM To: [log in to unmask] Subject: [TN] Phosphorous In The Nickel Barrier We are currently producing a number of printed wiring boards utilizing a Ni/Au plating for the final finish. The majority of these boards perform well throughout the process, but we have experienced solderability issues on a few assemblies that contain heavy copper (ground and/or power planes) on multiple layers. One of the causes is the presence of Phosphorous in the Nickel Barrier Level. Each thermal excursion the board is subjected to after the plating operation results in a higher level of phosphorous being present at the solderable surface. Are there any printed wiring fabrications shops out there that utilize what is referred to as a "low phosphorous nickel" (<6%) for plating versus a "medium phosphorous nickel" (6-9%)? To date, all the shops we have contacted utilize the "medium phosphorous nickel> Need some help. Thanks Ron Hollandsworth [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################