I have a question concerning plugged via holes under BGA components. During the SMT process of assembling a PCB I noticed clogged or plugged vias. I assumed it may have been from improper cleaning of misprinted PCBs. Upon further investigation I verified 98% of the bare PCBs had plugged vias. I am currently placing two BGA components ( 272, and 350 ball count, parameter array). In the case of all the PCBs the plugged vias are under both BGA components. I am concerned that not all the plugged vias are plated on the top or bottom of the PCBs. None are masked vias. I am concerned during the wave solder process I may have some trapped flux in a via that is not completely plugged resulting in outgasing and possible micro explosions under the BGA components. I contacted the PCB vender and was informed that plugged vias were industry standard and acceptable. Now to my question, it maybe acceptable for plugged vias on a PCB but what about under BGA components? Is there any information that addresses this issue? If so where can I find it? ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################