Neal, See answers following your questions. John Gulley - Process QE INET Technologies 1255 W. 15th St Plano, TX 75075 ______________________________ Reply Separator _________________________________ Subject: [TN] Moisture Sensitive Components Author: Neal W Driscoll <[log in to unmask]> at Internet Date: 8/24/98 9:03 AM We are an electronics manufacturing company starting to face the problems of handling moisture sensitive components. I am interested in finding out what other companies are doing in this area. Our initial thoughts on the subject are that we will get the moisture ratings from the manufactures and we will handle them and consume them within the times and conditions outlined in J-STD-020. Right now, doing something less than this does not appear to be an option. Based on following the times and conditions outlined in J-STD-020 here are some questions that come to mind: - Once the original manufacture's packaging has been opened, is re-packaging an option? YES! 1st - Check with the component manufacturers packaging and storage specifications. Identify what components will need storage. Identify to what extent will you need vacuum assisted hardware, 1/8th-1/6th dessicant packs, moisture barrier bags, humidity indicator card and oxidation arrest paper. Re-use the component suppliers bags where applicable. Date code the MBB. Another key here is to minimize the human factor of touching the components. Be sure to have specific front end instructions that ensure minimal damage to the component periphery With regards to hygroscopic dice, bake components on high (125°±5°) for one hour and no more than once. I only recommended baking if the Indicator card shows storage conditions to be excessive or it is known the storage environment is harsh. The additional baking will only proprogate the IMC. - My understanding is that the shelf life on packaged components is 12 months. If we re-package, does the 12 month clock start over, and if so, is there a document or standard that covers this part of the issue? Proper packaging will extend shelf life. Shelf life on components, not fabs, is influenced by temperature and humidity. Solderability degradation is induced by a condition called IMC or intermetallic compound (Cu6Sn5). - If re-packaging is an option, what are the different methods out there and their pro's and cons? See first answer. - What are the logistics of handling these components from the stock room to the production floor? See first answer. - If moisture sensitive components are going to be soldered by hand, do we need to be concerned with the special handling issue, and if not, is there a document or standard that covers this? There may NOT be an issue with soldering by hand since the heat applied is directed to one region at a time. However, Reflowing the component that is not hermitically sealed and not properly stored in poor humid conditions will probably initiate popcorning, bond lift, die delamination, etc. - Are there any other issues that might come up that go along with moisture sensitive components? - Are there any other industry standards that might help support and document what we do? If there is anything else I might need to be aware of, please throw it in. Any information that anyone can supply will be a great help. Thanks for your time. Call me should you need additional info. Neal Driscoll ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################