I am characterizing a high d.k.
metallized dielectric film for use as bulk and individual buried capacitors in
PCB's. The film is only a couple microns thick and the metallization is
thinfilm. Needless to say, handling and processing in a PCB environment
needs some creative solutions. Using combinations of blind vias, premounting to
prepreg/predrilling any PTH/NC (no connect) areas, temporary carriers for 2
sided imaging... I've come up with some methods. One question that arises
is what would the reliability be of a plated thruhole which connects to copper
cladding which may only be 1/4 to 1/2 micron thick vs. a normal minimum 10
microns with 1/4 oz copper foil??? Any suggestions would be
appreciated.
Resp
Phil
Hersey