Gold wire bonding to Electroless Ni /Immersion gold is at best risky.  More
gold is needed for a good Gold to Gold bond.  Electrolytic and electroless
gold may be nessecary at 20 - 30 uins, immersion Au is only 3 - 6 uins.
Electroless Ni Immersion Au is a good surface for Al wire bonding because Th
Al wire bonds to the underlying Ni.

George Milad
Tech Mkt Mgr
LeaRonal Inc

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