My thanks to everyone who answered my query about embedded components, and who forwarded me information about how to sign up for this list. Using the information you sent me (when compared with the original Japanese), I can now assume that what I am dealing with is hybrid components, which may or may not be embedded into the PWB itself. As a relative newcomer to the packaging field (I used to be a semiconductor engineer in years past) I will have to follow the leads you have so kindly provided before I understand totally what a "hybrid component" is -- because it can be embedded into the interconnecting substrate itself, it is certainly not the BiCMOS-type device I tend to think of when I hear the term "hybrid device." I gather from Dan Brandler that "integrated passive devices" are integrated into (or onto) the semiconductor die itself, so I don't think that this is what I am looking at. Perhaps the term "integral hybrid" would be best suited. I can relate well with your complaints about liberal arts Japanese majors who think that they can translate technical materials, or about Japanese engineers who think they can translate into English. Those of us who have left engineering to be translators are trying to do something about these other guys who give us a bad name! Even engineers have problems with translation, though -- although as an engineer I understand most of the technical materials I read in Japanese, I haven't actually worked in the packaging field, so I don't know how you guys talk. I am looking forward to reading your discussions on this mail list so I can study the words you use! Warren Warren ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################