Greg, The profile for flex differs little from any other PCB. You always start by following the solder supplier's preheat/reflow recommendations. The two things that can be different is the much lower thermal mass (though that depends on fixturing) and the differences in IR coupling. Both of these issues are so part/process dependent that I can't give you a general rule to follow. The only way to know is to measure it. Take care to get an actual reading of the pad surface and watch for hot spots as evidenced by locally discolored adhesive. The real trick with flex is the prebake to eliminate the absorbed moisture and thereby prevent delamination. Getting that right is far more important than just about anything you might logically do with the profle. Also, flex circuit adhesives have varying degrees of solder temperature resistance so take the time to find out what you're really working with. Andy Magee Flex Guru [log in to unmask] Greg Jones wrote: > Andy: > > Do you have any information on thermal profiles, especially how they may > differ from standard reflow or wave solder profiles? > > Thanks, > > Greg Jones > Technical Writer > KIC Thermal Profiling ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################