The concerns with NiP and NiB and solder joints have been of keen interest to
some of us in the industry who have had problems with these finishes and BGAs,
gullwing SMDs and Leadless Chip Carriers.  Several companies are working to
determine the exact cause and possible corrections.

The IPC National Conference on Surface Finishes and Solderability in
Bloomington MN last year had a couple of papers on the subject and the IPC
National Conference on Surface Finishes and Solderability to be held on
September 24th and 25th in Austin, TX  of this year will have a couple of
papers on the subject.  See the 2nd page of the July "Relay" for further
information or visit www.ipc.org..

The IPC Document section probably still has a copy of the Bloomington
conference for sale and sign up and come to Austin to hear more about it in
September.  Hope the weather has cooled by then.

Phil Hinton

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