We have a long time concerns in one of our product modules. These are the misalignment of LED components (SMD type) and no solder on its termination. The root cause of the problems have already pinpointed through our investigations. Potential cause is the termination design of the component is not suitable for the mounting orientation. The LED is being mounted in sideway direction and with said orientation, the design of the termination is only at the right, left and front sides. However, the bottom part of the LED has no termination which will serves as the conductor during metallic fusion between the solder pad and the component. The problem is, during the melting period of solder paste the component is also moving causing misalignment and often times no solder. We have conducted the evaluation using solder paste containing 2% silver (Sn62Pb36Ag2) but the problem still exists. We eliminated the misalignment by putting a non-conductive epoxy but no solder is still present in our line. Our customer won't allow us to modify the existing component even it is already pinpointed as the main cause. That's why we injected an inert gas (N2) in our process. Though our defects have been reduced by15% but we need to eliminate this variable. Does anyone have suggestions for our evaluation? Jon M. Pinca Supervising Process Engineer Electronic Assemblies, Inc. [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################