Hello Rusty, Consult "Wirebondability and solderability of various metallic finishes for use in printed circuit assembly." by Hillman, Bratin and Pavlov; 1996 IPC Expo, S.J. Results have shown peel strengths to be way below IPC wirebondability requirements, for Al wire on elNi/ImAu. Au wire, however, passes the peel strength requirement. Regards, Lenny Kurup EMX Enterprises Ltd. Markham, Ontario, Canada 905-475-8000 Ext 240. On Tue, 11 Aug 1998, Rusty Boyd wrote: > Hi, > A certain vendor claims that thermosonic Al to Ni wirebonding is possible. I am > looking for references to refute or support this claim. The precise claim is > that on a flexible PCB constructed of: > Kapton: 25 um > Cu: 7-8 um > Ni: 1.0 um > Au: 0.2 um > that thermosonic wire bonding with Al wire results in a wire bond to the Ni > layer. This claim was made after being confronted with the IPC recommendation > that at least 1 um of Au is required. > If anyone could share his/her experience(s) on this subject, or, better yet, > point me toward some authoritative reference(s), I would greatly appreciate it. > TIA, > Rusty > > > > > > Rusty Boyd > OUHEP - http://oua4.nhn.ou.edu/ > [log in to unmask] > office: (405)325-2890 x36316 > office fax: (405)325-7557 > home ph., fax and data: (405)447-5211 > University of Oklahoma > Dept. of Physics and Astronomy > 440 W. Brooks > Norman, OK 73019 > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################