For fine pitch devices 15.7 mils and small chips 0603 ,do we have any IPC standard stating that what kind of surface leveliing /planarity required for placement of FPDs and 0603/0402 chips.Even accurate placement can go offline once the surface is not flat. the situation is worse when we are trying to place 0603 components on glue dots. Also, there are no. of options for HAl alternatives . We are comparing gold immersion and OSPs.Our circuit boards are having fine pitch devices extendable to 12 mils QFPs and 50/60 mils BGAs and chips down to 0402 package size.We also intend to implement No-Clean process in near future. We have limited experience with Au immersion/Ni electroless and OSPs. What are views of experts who had some point of time decided course of action. What you think we go for?We want to go for process where we do not have to modify /readjust our current process based on water soluble soldering. Pro and Cons? Not to mention that I consider technet as my vital tool for problem solving. I will appreciate comments on this asap as I am running out of time and our process meeting is scheduled on Monady morning. thanks ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################