Currently, I am also working on writing procedure on handling all SMDs.
I would appreciate info on this.

thanks



> ----------
> From:         Neal W Driscoll[SMTP:[log in to unmask]]
> Sent:         August 27, 1998 8:57 AM
> To:   [log in to unmask]
> Subject:      [TN] Handling Moisture Sensitive Components
>
> Technetters,
>
> This is a follow up to an earlier e-mail I sent out concerning the
> handling
> of moisture sensitive components.  I have gotten some information
> concerning the issue and I am now trying to find out what
> processes/methods
> other electronic manufactures are using to address handling moisture
> sensitive components from receiving, to the stock room, to the
> manufacturing floor (SMD area).  Are people strictly re-packaging and
> issuing the parts?  Are nitrogen storage cabinets being used?  Are
> people
> skipping all handling precautions and just baking prior to SMD?  What
> are
> others doing????
>
>
> Any information would be appreciated.  Thanks.
>
>
> Neal Driscoll
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################