Neal, We use nitrogen storage cabinets for bulk storage and try to turn FIFO, WIP on the mfg. floor ASAP. Packages on the floor are sealed immediately after needed quantities of components are removed using nitrogen and a freshly baked desiccant bag. We track the cumulative open time of the package with a small label on the package. If the open cumulative time exceeds 44 hours, then we'll bake the components, but this rarely happens. The key is to keep WIP reduced, insure FIFO is implemented and keep turning the inventory. Sounds like a big deal, but really isn't. Most of this is done in off-line setups that are operating in parallel with the in process smd line. Hope this helps!! Dave Bishir II "Neal W Driscoll" <[log in to unmask]> on 08/27/98 08:57:31 AM Please respond to "\"TechNet E-Mail Forum.\" <[log in to unmask]>, Neal W Driscoll" <[log in to unmask]> To: [log in to unmask] cc: (bcc: David P Bishir II/HDC) Subject: [TN] Handling Moisture Sensitive Components Technetters, This is a follow up to an earlier e-mail I sent out concerning the handling of moisture sensitive components. I have gotten some information concerning the issue and I am now trying to find out what processes/methods other electronic manufactures are using to address handling moisture sensitive components from receiving, to the stock room, to the manufacturing floor (SMD area). Are people strictly re-packaging and issuing the parts? Are nitrogen storage cabinets being used? Are people skipping all handling precautions and just baking prior to SMD? What are others doing???? Any information would be appreciated. Thanks. Neal Driscoll ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################