Our CM (Contract Manufacturer) requested to use HASL rather then OSP. The CM
wanted 100 micro inches of tin lead plate for the BGA (for the HASL) and
they followed with about 6 mils of solder paste. As we began testing we
discovered we had numerous solder bridges under the BGA. Should we use any
HASL on the pads (plating) since the CM already uses 6 mils of solder paste?
Is this too much solder? Any suggestions?

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