Sure, we do. You don't want us throw away good paste for nothing do you? I was doing this from day one. As long as your operators can tell what is good and what is getting bad, you will not have any problem using leftover paste for next and next few days, or even next week. Our paste vendor's instruction is keep it air tight and leave it in a cool area for next day use and keep it away from heat source. Our process requires that when an operator opens a new solder paste jar (500gm), he or she writes an opened date on the bottom of jar. And when finished using for the day, he/she put a used paste back in the same jar and cleans up jar lids, rims and removes dried portions of paste and pushes the inner jar lid all the way down to remove air and then close the outer lid tight. Remind you nothing is air tight once a new jar is opened. Removing air in the jar is very important if a leftover paste jar is going to be used for next few days. Any paste jar that is getting bad or feeling bad by an operator's experience/skill is set aside for me to inspect or recycle it thru the wavesolder pot. I do not let or encourage my operators to mix a new paste with a used paste jar. They are allowed to replenish paste on the stencil that is being used. If curious, I am using Kester no clean paste. regards Matthew Park NII-Norsat Internationa Inc. >>> Ken Patel <[log in to unmask]> August 18, 1998 10:16 am >>> Does any contract assembly house store leftover solder paste in airtight jar at room temperature for next day's use? If so, I have few questions. (1) Does your paste manufacturer approved such process? (2) Is the paste remain in good condition and not drying out next day? Any comments are most welcomed. My assembly house has implemented this process and I have a serious reservation. Re, Ken Patel ______________________________________________________ Ken Patel Phone: (408) 490-6804 1708 McCarthy Blvd. Fax: (408) 490-6859 Milpitas, CA 95035 Beeper: (888) 769-1808 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################