On Fri, 14 Aug 1998, Dhawan, Ashok wrote: > 1.How many are using immersion gold with barrier under-plating as > process. What is process spec for finish as immersion gold--I mean > barrier plating and gold coating. Electroless nickel of 150~200 microinches is always the barrier between copper and immersion gold (3~6 microinches). Electroless nickel sould be 100 minimum, another 50 to ensure good performance. Immersion gold is self limiting up to ~8 microinches. > 2. If there is a board manufacturer(s), what is trend or percentage of > users on gold immersion? Probably 20 % of overall products. > 3. Anybody like to share the good or bad experience on technet. Can you > recommend any board manu with good experience on large volume, long time > troublefree supply of immersion gold finish. Try Dynamic Circuits Inc in Milpitas, CA. (1831 Tarob Court, Milpitas, CA95035, 408-263-0940) > 4. What is advise on electroless vs eletrolytic or anything else wrt > phosphorus?? Electroless nickel has about 8% of phosphorus. I donot see the phosphorus content matters a lot. you might prefer a certain percent of P according to your abssemble requirement. Technet had this disscussion before but i don't quite remember. > 5. What are the things I should check while going in for it. process controll of the line, defect history, SPC of plating thickness, compatibility of solder mask, etc. > > > > > > Ashok Dhawan P.ENG. > > Manufacturing Engineering > > Unisys Canada Inc. > > 51 Burmac Road > > Winnipeg R2J4C9 > > CANADA > > Fone 204-257-9199 > > Fax 204-257-9104 > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################