Technetter's Let's say a customer designed a board with the wrong pad size, too far apart, such that a gull wing lead placed on the pad doesn't have a heel fillet. Obviously a bad thing. A redesign is in progress, but in the interim it has been proposed that the part be reformed to spread the feet a bit further apart (by about 20 thou). Component is a 20 lead SOIC. My questions and concerns are: - the bend will have to occur at the point where the lead enters the component body, otherwise there will be no clearance between the part and the board. How dangerous is this from a reliability perspective (class 3 product, conformally coated)? Should I take the next few weeks off? Flee the country? Anyone have job openings? - do any technetters have suggestions of a half decent way to reform these? I'm currently faced with doing it to about 100 to 150 parts, and doing it by hand does not appeal to me due to the variability. Any other suggestions? I did consider borrowing some of the Freeze-it that Steve's using on his diodes, and shrinking the boards, but the reflow process might disagree with that... thanks! Graham Collins