Dear Technetters, Some people have asked what I am looking for in specfics, so I am sending it again. We are gathering any information helpful to 1.0 mm BGA design etc. Any information/guidelines related to board design, fabrication and assembly, and handling & shipping would be very helpful. Thanks, Yuan Li Packaging Engineer Altera Corp. 101 Innovation Drive, M/S 4101 San Jose, CA 95134 (408)544-7508 Fax (408) 544-6419 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################