MIL-P-50884, or whatever the IPC version is now, speaks very clearly about flex and rigid/flex delamination at the bare board level. It is no different after assembly. Part of the qualification process was to ensure acceptable quality and reliability, for quality conformance test circuitry and circuits, as received and after thermal stress and shock. Earl Moon ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################