Hi!
Our contract manufacturer employs HASL for the PCBs'. Previous to this the
CM was using OSP (Entek). He stated he has better quality using HASL PCBs.
However we are now experiencing some solder bridging under the BGA's. He is
using HASL,  WS 609 solder paste (6 mils), and what the solder bumps are on
the BGAs. This appears to be acceptable but why the solder bridging under
the BGA. What are your thoughts!

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