Charlie, Consider going to a gold board. We've been doing it on some fine pitch fabs with excellent results, no bridging even with 1:1 aperture ratios. See ya later.... Mike McMonagle PCA Process Engineering Supervisor K*Tec Electronics 1111 Gillingham Lane Sugar Land, TX 77478 (281) 243-5639 Phone (281) 243-5539 Fax [log in to unmask] > -----Original Message----- > From: Charles Barker [SMTP:[log in to unmask]] > Sent: Thursday, August 20, 1998 8:03 PM > To: [log in to unmask] > Subject: [TN] Help needed: Attaching leadless ceramic smd > > Hi there fellow Techies! > I need some advice/suggstions please. We need to attach a custom > leadless ceramic device to a board. The device is about .5" square > with > rounded off corners and has .025" pitch gold solder to pads on the > bottom > side only. The attachment surface does not run up the side of the > device in > the fashion of a normal castellation found on regular leadless ceramic > packages. These pads are .016 x .042 by about .002" thick. > The boards are hasl finished. The pads on the board are .016" x > .053". > The first attempt at soldering these was made using a .006" thick > stencil. > That produced all leads shorted together. The next run was with a > .004" > thick setncil. We still experienced some bridging. > Have any of you worked with such a device and/or do you have any > suggestions on the most reliable way to solder such a critter to a > board? > > Thanks in advance! > > Charlie Barker > [log in to unmask] > 281-552-3328 > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################