Rudy , could you please do us a favor and reflect on this subject ? I work on NiAu as well ; appreciate it Thanks a lot Paul Klasek http://www.resmed.com > ---------- > From: Earl Moon[SMTP:[log in to unmask]] > Sent: Friday, 31 July 1998 21:57 > To: [log in to unmask] > Subject: [TN] Electroless Nickel > > It has recently, and disruptively, been brought to my past ignorant > attention the problem associated with electroless nickel deposition > under electroless gold deposited SMT solder termination areas. I have > been informed, by a major BGA supplier, the deposition process relies > on > phosphorous as a component in the plating solution. Further, I have > been > told this is detrimental to solder joint formation. > > It is said, and has been proven by the BGA supplier, that phosphorous > causes solder joint problems by forming an internetallic that, over > time, causes embrittlement. Therefore, solder joints fail. > > Has anyone in industry addressed this issue from a PCB fabrication > standpoint? If so - how, and what is being done? Can we specify > electroplated nickel in approximately 100 millionths thickness as for > electroless types? If so, will this overcome the intermetallic, > embrittlement, and solder joint problem? > > Thanks, Earl Moon > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################