I would not use that Land Pattern without consulting my process engineer. A 4 mil space could create solder bridging during solder paste and reflow application. Unless, you are planning an alternate process. I know this does not answer your question, but just a word of caution. Tim Easterling Cadd Manager Commercial Engineering Technology Division SCI Systems Inc. (256)882-4426 (ph) (256)882-4305 (fx) ################################################################ DesignerCouncil E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE DesignerCouncil <your full name> To unsubscribe: SIGNOFF DesignerCouncil ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################