I would not use that Land Pattern without consulting my process engineer.
A 4 mil space could create solder bridging during solder paste and reflow
application. Unless, you are planning an alternate process.

I know this does not answer your question, but just a word of caution.



Tim Easterling
Cadd Manager Commercial Engineering
Technology Division
SCI Systems Inc.
(256)882-4426 (ph)
(256)882-4305 (fx)

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