I would like to first take this opportunity to thank everyone that has taken the time to assist me in my initial enquires. I have gathered alot of good content from all of you, and for that I grateful. Before formalizing the supplier survey, I would like to throw out a rough draft for last minute suggestions. If I have managed to overlook anything, please let me know. In closing, I would like to thank everyone for their participation. Company Name Company Address1 Company Address2 Country Zip Code Telecommunications Telephone Fax Number Modem Number Email Address Web Site Address Personnel CEO Quality Manager Engineering Manager Sales Manager No of Employees # of Purchasing Personnel # of Engineering Personnel # of Quality Personnel # of Production Personnel # of Production Control/Distribution Personnel # of Tool Making/Maintenance Personnel # of Administrative Personnel # of Others Manufacturing Focus Min # of Layers Max # of Layers Min Line Width (internal) Min Line Width (external) Line-to-Line Clearance (internal) Line-to-Line Clearance (external) Line-to-Land Clearance (internal) Line-to-Land Clearance (external) Min. Hole Size Min. SMT Pitch Max. Panel Size Aspect Ratio Product Mix S/S (% of Capacity) D/S (% of Capacity) Multilayer 4-6 layers (% of Capacity) Multilayer 8 + layers (% of Capacity) Flex & Rigid Flex (% of Capacity) Basic Plant Data No. of Shifts # of Hours per Shift # of Work Days/Year # Work Days/Week # of Holidays and Vacations Days Total Sq' of Capacity per day Total SQ' of Capacity per Month Manufacturing area/Sq Feet Current % of Capacity being Used Sq Footage of Facility Plant Character (High Volume, Medium Volume, Low Volume, Prototype) Average Leadtime (Production Parts) Average Leadtime (First Article) Customer Approvals Capacity Expansion Plans Current Capacity 6 Month Plan 12 Month Plan 24 Month Plan Design Capabilities Computer Aided Engineering & Equip Computer Aided Design & Equip Laser Plotter Electrical Testing Dedicated Test Fixture Automatic Test Fixture Special Technologies Blind Vias Buried Vias Microvia Rigid Microvia Flex Microvia-Laser Microvia-Plasma Photovia Carbon Ink COB BGA Backpanel Copper Invar Flexible Flex-Rigid IVH Hot Air Level Hot Oil Level RF Microwave Thin Core Processes Additive Semi-Additive Subtractive Thin Film Thin Foil Thick Film Base Materials Phenolic Glass Paper Epoxy Paper Epoxy Glass Polyimide Composite Polyimide Glass Cyanide Ester Flex Materials Teflon BT Epoxy PPE High performance epoxy PTFE Thermount RCC Polyimide Copper-Invar-Copper Copper-Moly-Copper Copper-Carbon-Copper Silicon/Glass Polyphenylene Ether/Glass Kevlar Aramid Insulated Metal Substrate Soldermask Dry Film Image Transfer LPI Drilling Small Hole Laser Drill Hard Tooling Blanking Pierce Routing NC Route Pin Route Perforate Laser Score V-Score Shear Only Electrical Test Dedicated Clamshell Continuity Flying Probe Net List Coatings Conformal Organic Paraxialine Solder OSP Plating Copper Tin Tin/Lead Tin/Nickel Tin/Nickel Alloy Nick/Gold (Hard) Nick/Gold (Immersion) Nick/Rodium Full Body Nickel Full Body Gold Selective Plating Palladium Palladium-Alloy Silver Bismuth Finishes Electroless Nickel Gold Immersion Silver Electroless Nickel Immersion Gold Electroless Palladium Brushed Tin Lead Electroless Tin Solder Fused Flux Roll Solder Tin/Lead Fused Triazode Entek UL Approvals UL Single Sided UL Double Sided UL Multilayer Approv # of Layers International Approvals CSA IECQ ISO 9001 ISO 9002 ISO 9003 ISO 14000 QS-9000 ESA (European Space Agency) VDE Raw Material Data Thin Laminate Suppliers Thick Laminate Suppliers Prepreg Supplier Etchant Supplier Soldermask Supplier Basic Equipment Data AOI Inspection Equipment In-House Lamination Finanicial Data Terms: Net Days Currency: Dun & Bradstreet # Years in Business Annual Revenues Best Regards ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################