Hi Jason,

I am in concurrence with George Milad, but there is one other thing You can do
that others have not mentioned, if you have the freedom to do so. Increase the
Anode to Cathode distance. A rule of thumb is about 12 inches, but greater than
that will help if you can. It will consume a little more power in your plating
operation, but help the throwing power.

Good Luck,

Les Connally

>  From: Jason Zhao <[log in to unmask]>, on 7/1/98 8:11 AM:
>  Hello, everyone.
>  I am doing a project to improve our capability and overcome the
>  overplating issues in copper plating. the vendor suggested us to reduce
>  the number of anodes to lower the surface to
>  hole ratio. Would that help? What are the other factors that affect the
>  surface to hole ratio? we are using electrochemicals PC-667 acid
>  copper.
>  Thank you in advance.
>
>  Ja
>
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