Following is text of a letter of interest to the industry. ============== From: Defense Logistics Agency, Defense Supply Center, Post Office Box 3990, Columbus, OH 43216-5000 Dated June 11, 1998 MEMORANDUM FOR MILITARY/INDUSTRY DISTRIBUTION SUBJECT: Cancellation of MIL-S-13949, General Specification for Printed Wiring Board Sheets, all Associated Specification Sheets, the Associated Qualification Program, and QPL-13949 "MIL-S-13949, all associated specification sheets, the associated qualification program, and QPL-13949 are scheduled t be canceled November 30, 1998. This is advance notice to the military and industry so they may prepare for this cancellation. Manufacturers who supply printed wiring boards of Government/military contracts where MIL-S-13949 compliant product is specified should contact their affected customers to discuss documentation, contractual and/or any other technical issues which may need to be addressed upon cancellation. "For those that wish to respond to this cancellation, please send questions or comments to Monica Poelking, DSCC-VAC, at the address above, or email: [log in to unmask] or phone at 614-692-0674, DSN 850-0674." /s/ DAVID E. MOORE Chief Document Control Unit ============== IPC-4101 "Specifications for Base Materials for Rigid and Multilayer Printed Boards" covers the requirements for base materials (Laminate or prepreg) to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits. A series of specification sheets, which outline the requirements for both laminate and prepreg for each product grade, is included in the document. Use IPC-4101 in place of MIL-S-13949. 149 pages Released December 1997 IPC Member $40 Nonmember: $80 IPC is hosting a series of workshops to help industry transition to IPC-4101. The workshops, titled "Setting the Standard and Charting the Future" are scheduled as follows: September 10, 1998 - Los Angeles, CA September 11, 1998 - San Jose, CA September 14, 1998 - Boston, MA September 15, 1998 - Dallas, TX September 16, 1998 - Minneapolis, MN Contact: MaryEllen Hilderbrand at 847.509.9700 X 382 or e-mail [log in to unmask] IPC-4101 replaces IPC-L-108, IPC-L-109B, IPC-L-112A, IPC-L-115B Related documents for IPC-4101 IPC-CC-110 "Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications" IPC-2221 "Generic Standard on PWB Design" IPC-2222 "Sectional Standard on Rigid PWB Design" IPC-1730 "Laminate Qualification Profile" IPC/SMTA Electronics Assembly Expo Technical Committee Meetings, Conference, Exhibits Providence RI October 24-29 More info at http://www.ipc.org Jack Crawford, IPC Project Manager - Assembly 2215 Sanders Road, Northbrook IL 60062-6135 [log in to unmask] 847-509-9700 x 393 fax 847-509-9798 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################