IPC is looking for presenters for IPC Printed Circuits Expo '99 March 14-18, 1999 Long Beach Convention Center Long Beach, CA http://www.IPC.org/html/expocov.htm IPC Printed Circuits Expo is the largest conference and exhibition in North America for the printed circuit industry. As the 7,700 international attendees of 1998's event can attest, there is no better forum for users, builders, and designers of printed wiring boards. Why Should Your Company Be A Part of the Technical Program? Developed and designed by the industry, for the industry, IPC Printed Circuits Expo provides unparalleled visibility for you and your company. Your presence at the event defines your company as an industry leader and enhances your professional reputation. Distribution of the conference proceedings to over 1,500 companies and individuals will help ensure that your paper is seen by key engineers and managers throughout the industry. IPC Printed Circuits Expo brings industry experts and newcomers together to help shape the industry's response to the next set of manufacturing challenges. Your participation contributes to the advancement of our industry. Industry leaders writing new industry standards and guidelines will be able to refer to your findings. Seize this opportunity through your participation as a speaker. A Meaningful Venue The technical conference is one of the primary attractions of IPC Printed Circuits Expo. Over 80 papers covering areas from board design to materials to manufacture to assembly technology will be presented. Some "hot topic" sessions reached over 200 attendees in standing room only crowds in 1998. Twelve-hundred professionals attended 45 workshops and tutorials featuring topics from training to reliability to chip scale packaging. Whether you choose to present an original paper, participate on a panel, or educate the industry by leading a workshop or tutorial, your contribution to IPC Printed Circuits Expo will be rewarding and an asset to the industry. HOW CAN YOU PARTICIPATE? Chair a Technical Session or Panel Discussion Requirements: Comprised of four to five speakers from different companies speaking on various areas of a common theme. Individuals interested in organizing a session of this type must provide a proposed session scope and tentative speaker names by August 17, 1998. On-site time required: three hours. Present a Paper at the Technical Conference Requirements: Provide print quality material for proceedings; an abstract submission of 75-100 words; and a brief biography. Presentation materials and papers must be noncommercial in nature. The author of the best technical paper will be awarded $1000 and a recognition plaque. Abstracts and papers submitted should describe significant results from experiments, emphasize new techniques, discuss trends of interest, and contain technical, economic, or appropriate test data. Papers focused on a company's product, rather than on the technology, will not be accepted. Also, it is mandatory for all presenters to provide a publishable paper in order to make an oral presentation. On-site time required: 30 minutes. The deadline for abstract submission is The deadline for paper submission is August 17, 1998. January 4, 1999. Lead a Workshop or Tutorial Requirement: Provide materials and teach a three-hour workshop or seven-hour tutorial. An honorarium is offered for tutorial or workshop leaders. The deadline for abstract submission is August 17, 1998. Workshop and tutorial presenters must provide all final handbook materials by January 18, 1999. Send an email to [log in to unmask] with your proposal TODAY and become a part of IPC Printed Circuits Expo '99. Suggested Topics NEXT GENERATION OF PWBs Needs of OEMs Plugged, Filled and/or Tented Vias Reliability Comparisons Integrated Components (i.e.: Transformers, LEDs, etc.) HIGH DENSITY INTERCONNECTS Microvias Reliability/Failure Analysis Techniques(assembly, rework/repair, etc.) Infrastructure Development Case Studies ADVANCED PACKAGING Ball Grid Array/Chip Scale High-Density Packaging Organic Chip Carrier Manufacturing Flip Chip Reliability PC BOARD FABRICATION Direct Imaging Fine Line Imaging Use of Low Dielectric Materials Horizontal Plating of Thin Cores Periodic Pulse Reverse Plating Direct Metallization FLEX CIRCUITS Flex Interposers Flexural Endurance of Copper & Laminates Market DESIGN Impact on Cost High Speed Design Design for Manufacture Simulation of Fatigue Design of Microvias/HDIS ENVIRONMENTAL Environmental Cost Accounting Tools ISO 14001/Environmental Management Systems (EMS) Environmentally-Friendly Manufacturing Materials/Methods Lead-Free Solder & Finishes MATERIALS New/Alternative Resins Inks, Pastes & Thick Films Polymer vs. Process Interactions Advances in Laminates, Prepregs & Other Materials ASSEMBLY TECHNOLOGY Conductive Adhesives Flip Chip Conformal Coatings Alternative Surface Finishes for Fine Pitch Lead-Free Solders Materials for Conductive Paths TEST AND INSPECTION Bare Board Test on HDI Boundary Scan AOI QUALITY AND RELIABILITY Continuous Process Improvement Plated Through-Hole Reliability Solder Joint Reliability Design of Experiments IMPLEMENTING STANDARDS IPC-4101, Materials IPC-2510, GenCAM IPC 2215 Sanders Road Northbrook, IL 60062 tel 847.509.9700 fax 847.509.9798 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################