can't you provide an stencil aperture for the component underside and use solder for that interconnection so as to not add a dispensing process to your process flow...if done correctly, you should not have any intermittent connections...some of the problems with using conductive adhesives are CTE mismatches, depending on the paste you may have issues with rosin residues, forming adequate fillets around the component and probably most important...rework! Marcelo -----Original Message----- From: Jan Satterfield [SMTP:[log in to unmask]] Sent: Monday, July 06, 1998 11:30 AM To: [log in to unmask] Subject: [TN] ASSY: Thermally/Electrically Conductive Epoxy We have an RF component that contains a metal pad on the underside of the component that is soldered to a pad on the pwb. After reflow we are getting intermittent connections. I need to find a thermally and electrically conductive epoxy that I can use to bond the metal pad to the pwb and will then withstand the temperatures of reflow while the leads are soldered. This epoxy will need to be applied with a dispenser due to high volume. Any suggestions or vendors that I might contact? ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################