Jared, We use ANSI/J-STD-003 (april '92) which requires a solder pot of 245C +/-5 or 473F. It does require using a non-activated rosin flux or another flux if agreed upon between the user and vendor. I've done this test and have tried a number of various fluxes. My experience has shown that I find no difference in solderability between flux as I go from fully activated to non-activated (using Kester brand). However, we've recently tried no clean flux and have noticed a difference, specifically, poorer solderability. The reason I don't think the regular fluxes make much difference is that they mainly acting as wetting agents since there is no preheat present to allow the flux to do it job. Lastly, the test is good and can easily catch gross solderability problems. It's the marginal cases that are hard to catch with this test. That's one reason we tried the no clean, to more accurately similate what's being used in mfg. Sincerely, Paul Terranova DIGITAL's Analytical and Environmental Test Services Lab Phone: 508-467-3109 FAX: 508-467-6796 [log in to unmask] http://www.digital.com/lab-services -----Original Message----- From: Jared Lang [mailto:[log in to unmask]] Sent: Friday, July 17, 1998 6:16 PM To: [log in to unmask] Subject: [TN] Lead Solderability Importance: High Hi Technetters, I have a question that I need an answer to. I am having an ongoing battle with one of our T/H power resistor vendors. My question is: In testing the lead solderability of a component, if the solder pot is a >600 deg, would this be sufficient to burn off the oxides on the leads and give an indication of acceptable lead solderability in the absense of flux. The QC tech set-up this procedure last year before he left and it was in place before I arrived. I have evaluated ANSI J/STD-002 test method A ( I have not had time to find out if there is an appropriate IPC standard) and we can use this, but the vendor is screaming because we were not using a "true" procedure. In an attempt to validate this, last year, I sent a sample of resistors from a lot that failed to an outside lab and they confirmed the indication of failures. Any input will be greatly appreciated, since I have to meet with the vendor next wedensday to resolve this. Thanks in advance, Jared Lang Manufacturing Engineer Minarik Corp. Glendale, CA. 818-637-7434 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################