Dear Technetters, we currently design our PCBs so that the pads for chip components are thermally balanced, thus avoiding any tombstoning. The problem is that ideally we need to connect the ground side of the components to a large plane for good RF characteristics at high frequencies. Does anyone have any ideas on how to get around this problem ? We Heller and Quad forced convection reflow ovens, which should reduce any tombstoning rates. Thanks in advance for any replies. Chris Murphy ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################