Hi Technetters, I have a question that I need an answer to. I am having an ongoing battle with one of our T/H power resistor vendors. My question is: In testing the lead solderability of a component, if the solder pot is a >600 deg, would this be sufficient to burn off the oxides on the leads and give an indication of acceptable lead solderability in the absense of flux. The QC tech set-up this procedure last year before he left and it was in place before I arrived. I have evaluated ANSI J/STD-002 test method A ( I have not had time to find out if there is an appropriate IPC standard) and we can use this, but the vendor is screaming because we were not using a "true" procedure. In an attempt to validate this, last year, I sent a sample of resistors from a lot that failed to an outside lab and they confirmed the indication of failures. Any input will be greatly appreciated, since I have to meet with the vendor next wedensday to resolve this. Thanks in advance, Jared Lang Manufacturing Engineer Minarik Corp. Glendale, CA. 818-637-7434 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################